At one end of the GO link is a USB-C connector, and at the other is the DAC and headphone amp circuitry, both housed in robust yet lightweight magnesium alloy enclosures.
In between is a 6cm length of flexible cable – this aids practicality, allowing the DAC/amp section to be angled towards the listener and reducing stress on the USB port to which the GO link is connected
At the heart of the GO link lies a power-efficient, high-performance DAC chip from ESS Technology’s Sabre HiFi series – the ES9219MQ/Q – benefiting from 32-bit HyperStream III architecture.
This combines with Quad DAC+ and Time Domain Jitter Eliminator technologies, plus our dedicated clock circuitry utilising a specialised crystal oscillator, to deliver ultra-low distortion, excellent clarity and impressive dynamic range.
Rarely implemented high-end features such as adjustable analogue gain with DRE (Dynamic Range Enhancement) plus technologies to minimise THD (Total Harmonic Distortion) and crosstalk are possible due to the DAC chip’s advanced specification.
It is also possible to choose between a choice of digital filters via downloadable software.
The cable linking both sections together uses silver-plated copper conductors with individual polymer insulation in a ‘twisted pair’ configuration.
This rotational twist helps to optimise inductance and capacitance and also aids noise rejection. The GO link’s sound isn’t affected by electromagnetic interference picked up from nearby electrical sources.
No distortion means you’re ready to dance without disturbance.
Unlike other headphone dongles, the GO link doesn’t rely on the software-based volume controls in connected digital devices. This can adversely affect audio resolution.
Instead, adjusting the volume on the connected device controls the volume level in the GO link’s DAC, not in the phone, tablet or computer. This hardware-based volume control is another feature that helps to deliver the GO link’s superior sonic performance.